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Carbon Nanotubes Outperform Copper Nanowires as Interconnects
![]() Home » News » Ceramic Tech Today » 2008 » Carbon Nanotubes Outperform Copper Nanowires as Interconnects
Carbon Nanotubes Outperform Copper Nanowires as Interconnects 4/7/2008 Researchers
at Rensselaer Polytechnic Institute have created a road map that brings
academia and the semiconductor industry one step closer to realizing carbon
nanotube interconnects, and alleviating the current bottleneck of information
flow that is limiting the potential of computer chips in everything from personal
computers to portable music players. To better
understand and more precisely measure the key characteristics of both copper
nanowires and carbon nanotube bundles, the researchers used advanced
quantum-mechanical computer modeling to run vast simulations on a high-powered
supercomputer. It is the first such study to examine copper nanowire using
quantum mechanics rather than empirical laws. After
crunching numbers for months with the help of Rensselaer’s
“With this
study, we have provided a road map for accurately comparing the performance of
copper wire and carbon nanotube wire,” said Saroj Nayak, an associate professor
in Because of the nanoscale size of interconnects, they are subject to quantum phenomena that are not apparent and not visible at the macroscale, Nayak said. Empirical and semi-classical laws cannot account for such phenomena that take place on the atomic and subatomic level, and, as a result, models and simulations based on those models cannot be used to accurately predict the behavior and performance of copper nanowire. Using quantum mechanics, which deals with physics at the atomic level, is more difficult but allows for a fuller, more accurate model. Nayak said
there are still many challenges to overcome before mass-produced carbon
nanotube interconnects can be realized. There are still issues concerning the
cost of efficiency of creating bulk carbon nanotubes, and growing nanotubes
that are solely metallic rather than their current state being of partially
metallic and partially semiconductor. More study will also be required, he
said, to model and simulate the effects of imperfections in carbon nanotubes on
the electrical resistance, contact resistance, capacitance, and other vital
characteristics of a nanotube interconnect. Funding for this project was
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